Brief introduction
| model | HongJin-H1832 |
| Specification | 30G/branch |
| characteristic | HongJin-H1832 is a one-component repairable capillary flow underfill specially developed for CSP and BGA applications. The product has good fluidity and construction operability. After curing, the product has excellent electrical properties, weather resistance and thermal aging properties, and can be repaired at the same time. |
| Applicable Products | bottom padding |
Technical parameter
Attributes | magnitude |
type | epoxy glue |
viscosity（at 25°） | 500±100(mPa·s) |
density（g/cm3） | 1.4±0.2 |
hardness（Shaw BrothersD） | 80+/-15 |
Shear force（MPa）（Fe/Fe） | 10Min. |
water absorption | ＜1.0% |
Dielectric constant（1MHz） | 100% |
surface resistance（Ω） | 1.2×1012 |
Operation time（After opening） | 12H |
Precautions
1、Please store glue at -20°C.
2、Warm up the glue at room temperature for 2 hours before use.
3、Before bonding, the bonding surface must be kept clean and free from water, oil, rust, etc. Better after sanding.
4、After dispensing, please strictly follow the conditions recommended in the specification.
