HongJin-H2535 one-component low temperature curing epoxy adhesive

Brief introduction

model	HongJin-H2535
Specification	30G/branch
characteristic	HongJin-H2535 is a one-component epoxy resin adhesive that is very suitable for low temperature and fast curing on SMT. It can still maintain a stable shape without drawing, overflowing, and collapse in ultra-high-speed micro-coating. It is stable in storage and has Excellent thermal shock resistance and electrical properties, safe to use, and fully comply with environmental protection requirements.
Applicable Products	Bonding and fixing of electronic components

Technical parameter

Attributes	magnitude
type	epoxy glue
viscosity（at 25°）	38000±10000(mPa·s)
density（g/cm³）	1.4±0.2
hardness（Shaw BrothersD）	80+/-15
Shear force（MPa）（Fe/Fe）	10Min.
water absorption	＜1.0%
Dielectric constant（1MHz）	100%
surface resistance（Ω）	1.2×10¹²
Operation time（After opening）	12H

Precautions

1、Please store glue at -20°C.

2、Warm up the glue at room temperature for 2 hours before use.

3、Before bonding, the bonding surface must be kept clean and free from water, oil, rust, etc. Better after sanding.

4、After dispensing, please strictly follow the conditions recommended in the specification.