HongJin-H1817 One-component epoxy resin adhesive

Brief introduction:

model:	HongJin-H1817
Specification:	30G/branch
characteristic:	HongJin H1817 is a one-component fast-curing epoxy resin adhesive with good flow and workability. At the same time, the product can form excellent adhesion between many different types of materials. At the same time, it is a high-temperature-resistant glue that can pass reflow soldering. It can still maintain a good bonding effect when it passes through 260-degree reflow soldering, and its waterproof level can exceed level 7.
Applicable Products:	Watertight sealing and structural bonding of consumer and industrial electronics

Technical parameter:

Attributes	magnitude
type	epoxy glue
viscosity（at 25°）	8000±1000 (mPa·s)
density（g/cm3）	1.2±0.15
hardness（Shaw BrothersD）	80+/-15
Shear force（MPa）（Fe/Fe）	8 Min.
water absorption	<1.5%
Curing rate	100%
Operation time（After opening）	12H

Precautions:

1、Please store glue at -20 degrees.

2、Warm up the glue at room temperature for 2 hours before use.

3、Before bonding, the bonding surface must be kept clean and free from water, oil, rust, etc. Better after sanding.

4、After dispensing, please strictly follow the conditions recommended in the specification.