HongJin-H1800 one-component low temperature fast curing epoxy resin adhesive

Brief introduction

model	HongJin-H1800
Specification	30G/branch
characteristic	HongJin-H1800 is a one-component low-temperature fast-curing epoxy resin adhesive. It is mainly used for bonding various plastic products, metal parts, heat-sensitive components, such as memory cards, CCD/CMOS, etc. It can also be used for bonding and reinforcing various active and passive components in PCBA assembly.
Applicable Products	Bonding of various metal and non-metallic devices, VCM motor bonding, etc.

Technical parameter

Attributes	magnitude
type	epoxy glue
viscosity（at 25°）	35000±10000(mPa·s)
density（g/cm3）	1.3±0.2
hardness（Shaw BrothersD）	75+/-15
Shear force（MPa）（Fe/Fe）	20Min.
water absorption	＜1.0%
Curing rate	100%
surface resistance（Ω）	1.2×10¹²
Operation time（After opening）	12H

Precautions

1、Please store glue at -20 degrees.

2、Warm up the glue at room temperature for 2 hours before use.

3、Before using glue, use it in small quantities to avoid massive problems.

4、Before bonding, the bonding surface must be kept clean and free from water, oil, rust, etc. Better after sanding.

5、After dispensing, please strictly follow the conditions recommended in the specification.