300ml/branch

HongJin-T3500 is a one-component room temperature curing silicone thermal conductive adhesive, which is cross-linked and cured by condensation reaction in contact with moisture in the air, and becomes a high-performance elastomer. After curing, it is closely attached to the surface in contact with it to reduce the thermal resistance, which is beneficial to the heat conduction between the heat source and the surrounding heat sink or the main board and the casing. This series of products have excellent thermal conductivity, good electrical insulation properties, excellent moisture resistance, shock resistance, corona resistance and anti-leakage properties, high and low temperature resistance, non-swelling and good adhesion to most metal and non-metal materials. It can seal and bond electronic components.

Widely used in heat conduction and bonding between high-power power modules and radiators; heat conduction and bonding between LED lamp aluminum substrates and radiators; cache memory; integrated circuits, CPU processors; power modules, DC/AC converters ;Power modules, power tubes, diodes, triodes, semiconductors, relays, transformers, ballasts, thermally conductive filling and bonding; can replace the traditional way of fixing with circlips and screws